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Brazing, soldering and welding Soldering, welding fillers Soft solder Electronic solder
Soft lead-free solder Electronic solder no. 1
Brazing, soldering and welding Soldering, welding fillers Soft solder Electronic solder
Soft lead-free solder Electronic solder no. 1
Soft lead-free solder Electronic solder no. 1
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Tecnical Description
- Weight of content: 250 g
- EN standard: 29454-1
- Max. processing temperature: 450 °C
- ISO: 9453
- Material designation: S-Sn99.3Cu0.7
- Cu composition of the brazing solder (weight-%): 0.7 %
- Sn composition of the brazing solder (weight-%): 99.3 %
- Min./max. processing temperature: 350 to 450 °C
- Min. processing temperature: 350 °C
- Min. melting temperature: 227 °C
Wire diameter
Weight of content
Material designation
EN standard
Code
Package / Quantity
Price (AMD)
Code: 09871113
Product information
Catalogue page as PDF 1
Tecnical Description
- Wire diameter 1 mm
- Weight of content 250 g
- Material designation S-Sn99.3Cu0.7
- EN standard 29454-1
- Cu composition of the brazing solder (weight-%) 0.7 %
- ISO 9453
- Sn composition of the brazing solder (weight-%) 99.3 %
- Min./max. processing temperature 350 to 450 °C
- Min. processing temperature 350 °C
- Max. processing temperature 450 °C
- Min. melting temperature 227 °C
Code: 09871133
Product information
Catalogue page as PDF 1
Tecnical Description
- Wire diameter 1.5 mm
- Weight of content 250 g
- Material designation S-Sn99.3Cu0.7
- EN standard 29454-1
- Cu composition of the brazing solder (weight-%) 0.7 %
- ISO 9453
- Sn composition of the brazing solder (weight-%) 99.3 %
- Min./max. processing temperature 350 to 450 °C
- Min. processing temperature 350 °C
- Max. processing temperature 450 °C
- Min. melting temperature 227 °C
Specification
- RoHS-compliant
- S-Sn99,3Cu0,7 in accordance with DIN EN ISO 9453
- Fluxing composition in accordance with DIN EN 29454.1, 1.1.2.B with organic, halogen-free activation additives
- Processing temperature: 350-450u00b0C
- Melting range: 227u00b0C
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