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Soft lead-free solder Electronic solder no. 10

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Tecnical Description

  • Weight of content: 250 g
  • EN standard: 29454-1
  • Max. processing temperature: 450 °C
  • ISO: 9453
  • Min./max. processing temperature: 350 to 450 °C
  • Min. processing temperature: 350 °C
  • Min. melting temperature: 227 °C
  • Material designation: S-Sn99Cu1
  • Cu composition of the brazing solder (weight-%): 1 %
  • Sn composition of the brazing solder (weight-%): 99 %

Wire diameter

Weight of content

Material designation

EN standard

Code

Package / Quantity

Price (AMD)

0.7 mm

250 g

S-Sn99Cu1

29454-1

x 0

Code: 09871053

Product information

Catalogue page as PDF 1

Tecnical Description

  • Wire diameter 0.7 mm
  • Weight of content 250 g
  • Material designation S-Sn99Cu1
  • EN standard 29454-1
  • Cu composition of the brazing solder (weight-%) 1 %
  • ISO 9453
  • Sn composition of the brazing solder (weight-%) 99 %
  • Min./max. processing temperature 350 to 450 °C
  • Min. processing temperature 350 °C
  • Max. processing temperature 450 °C
  • Min. melting temperature 227 °C

1 mm

250 g

S-Sn99Cu1

29454-1

x 0

Code: 09871073

Product information

Catalogue page as PDF 1

Tecnical Description

  • Wire diameter 1 mm
  • Weight of content 250 g
  • Material designation S-Sn99Cu1
  • EN standard 29454-1
  • Cu composition of the brazing solder (weight-%) 1 %
  • ISO 9453
  • Sn composition of the brazing solder (weight-%) 99 %
  • Min./max. processing temperature 350 to 450 °C
  • Min. processing temperature 350 °C
  • Max. processing temperature 450 °C
  • Min. melting temperature 227 °C

1.5 mm

250 g

S-Sn99Cu1

29454-1

x 0

Code: 09871093

Product information

Catalogue page as PDF 1

Tecnical Description

  • Wire diameter 1.5 mm
  • Weight of content 250 g
  • Material designation S-Sn99Cu1
  • EN standard 29454-1
  • Cu composition of the brazing solder (weight-%) 1 %
  • ISO 9453
  • Sn composition of the brazing solder (weight-%) 99 %
  • Min./max. processing temperature 350 to 450 °C
  • Min. processing temperature 350 °C
  • Max. processing temperature 450 °C
  • Min. melting temperature 227 °C

2 mm

250 g

S-Sn99Cu1

29454-1

x 0

Code: 098711003

Product information

Catalogue page as PDF 1

Tecnical Description

  • Wire diameter 2 mm
  • Weight of content 250 g
  • Material designation S-Sn99Cu1
  • EN standard 29454-1
  • Cu composition of the brazing solder (weight-%) 1 %
  • ISO 9453
  • Sn composition of the brazing solder (weight-%) 99 %
  • Min./max. processing temperature 350 to 450 °C
  • Min. processing temperature 350 °C
  • Max. processing temperature 450 °C
  • Min. melting temperature 227 °C
Specification
  • RoHS-compliant
  • S-Sn99,3Cu0,7 in accordance with DIN EN ISO 9453
  • Fluxing composition in accordance with DIN EN 29454.1, 1.1.2.B with organic, halogen-free activation additives
  • Processing temperature: 350-450u00b0C
  • Melting range: 227u00b0C

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